The Iyengar Type Inequalities with Exact Estimations and the Chebyshev Central Algorithms of Integrals

In this paper, both low order and high order extensions of the Iyengar type inequality are obtained. Such extensions are the best possible in the same sense as that of the Iyengar inequality. hzrthermore, the Chebyshev central algorithms of integrals for some function classes and some related problems are also considered and investigated.     

Investigation of the Property Constants of Both Al and Cu Complexes with Picramine Ca and Using Competition Coordination for the Selective Determination of Trace Amounts of Cu

The reactions between Cu(II) and picramine CA (PCA) and Al(III) and PCA were both sensitive at pH 7. The competition coordination between Cu and the Al–PCA complex was applied to the selective determination of Cu (CCSD) by the spectral correction technique. Results have shown that the complexes formed at pH 7 are Al₂(PCA) and Cu(PCA)₃, their cumulative stability constants are 4.43 × 10⁵ and 2.08 × 10¹⁵, respectively, and their real molar absorptivities are 5.78 × 10³ at 650 nm and 3.19 × 10⁴at 530 nm. At the analysis of the samples, the relative standard deviation (RSD) was 5.0% and the recovery rate of Cu was between 94 and 108%.     

Deposition of Hydrogen-Free Silicon Nitride Thin Films by Microwave ECR plasma Enhanced Magnetron Sputtering at Room Temperature

Hydrogen-free silicon nitride （SiNx） films were deposited at room temperature by microwave electron cyclotron resonance （MW-ECR） plasma enhanced unbalance magnetron sputtering system. Both Fourier-transform infrared spectroscopy and x-ray photoelectron spectroscopy are used to study the bonding type and the change of bonding structures of the silicon nitride films. The results indicate that the chemical structure and composition of SiNx films deposited by this technique depend strongly on the N2 flow rates, the stoichiometric SiNx film, which has the highest hardness of 22.9 GPa, could be obtained at lower N2 flow rate of 4 sccm.     

3,7-二硝基亚氨基-2,4-二氮杂双环[3,3,0]辛烷的放热分解反应动力学

在程序升温条件下 ,用DSC研究了标题化合物的放热分解反应动力学 .用线性最小二乘法、迭代法以及二分法与最小二乘法相结合的方法 ,以积分方程、微分方程和放热速率方程拟合DSC数据 .在逻辑选择建立了微分和积分机理函数的最可几一般表达式后 ,用放热速率方程得到相应的表观活化能 (Ea)、指前因子 (A)和反应级数 (n)的值 .结果表明 :该反应的微分形式的经验动力学模式函数、Ea 和A值分别为 (1-α) 0 .44、2 30 .4kJ/mol和 10 18.16s-1.借助加热速率和所得动力学参数值 ,提出了标题化合物放热分解反应的动力学方程 .该化合物的热爆炸临界温度为 30 2 .6℃ .上述动力学参数对分析、评价标题化合物的稳定性和热变化规律十分有用 .     

奇妙的惯性力

实际的参考系都不是惯性系，因此必须考虑惯性力．     

环境对MgB_2氧化过程中MgO晶须生长形状的影响

用扫描电镜研究了在 Mg B2 氧化过程中环境对 Mg O晶须生长形状的影响。仅有 Mg B2 时 ,在 80 0℃左右空气气氛中 ,可生长出纳米尺寸的 Mg O晶须。若把 Mg B2 添加到氧化铝陶瓷基体中 ,则生长成竹节状晶须。Mg O晶须生长形状的差别可能是由于氧浓度以及位错等因素造成的。     

碳纳米管阵列、捆束的三步升温工艺制备及其形貌与结构

使用结构简单的单温炉设备，通过三步升温热解二茂铁、三聚氰氨混合物方法，在二氧化硅、多晶陶瓷基底上分别合成了碳纳米管阵列、碳纳米管捆束.使用扫描电子显微镜、透射电子显微镜、电子能量损失谱和x射线光电子能谱对合成样品进行了结构和成分分析.结果显示：两种基底上合成的纳米管均为多壁纯碳管；生长于光滑二氧化硅表面的碳纳米管具有高度取向性和一致的外径，长度为10—40μm.碳纳米管采取催化剂顶端生长模式并展示出类杯状形貌；生长于粗糙多晶陶瓷表面的碳纳米管捆束随机取向，碳纳米管直径为15—80nm，长度在几百微米，展示 关键词： 碳纳米管 热解法 三步升温工艺     

新型菲涅尔线聚光太阳电池组件特性分析

以PMMA为材料,采用热压成型工艺加工线聚焦菲涅尔聚光棱镜,对在其聚光条件下不同入射角度情况下太阳电池的电流电压特性进行测试,结果表明:该菲涅尔线聚焦棱镜能有效提高太阳电池的单位输出功率,而且具有比较宽泛的集光角的特性,基本满足实际应用的要求.     

Sulfonated poly(aryl ether ketone)s containing naphthalene moieties obtained by direct copolymerization as novel polymers for proton exchange membranes

A series of sulfonated poly(aryl ether ketone)s (SPAEKs) were prepared by aromatic nucleophilic polycondensation of 2,6‐dihydroxynaphthalene with 5,5′‐carbonyl‐bis(2‐fluorobenzenesulfonate) and 4,4′‐difluorobenzophenone. The structure and degree of sulfonation (DS) of the SPAEKs were characterized using ¹H NMR spectroscopy. The experimentally observed DS values were close to the expected values derived from the starting material ratios. The thermal stabilities of the SPAEKs were characterized by thermogravimetric analysis, which showed that in acid and sodium salt forms they were thermally stable in air up to about 240 and 380 °C, respectively. Transparent membranes cast from the directly polymerized SPAEKs exhibited good mechanical properties in both dry and hydrated states. The dependence of water uptake and of membrane swelling on the DS at different temperatures was studied. SPAEK membranes with a DS from 0.72 to 1.60 maintained adequate mechanical properties after immersion in water at 80 °C for 24 h. The proton conductivity of SPAEK membranes with different degrees of sulfonation was measured as a function of temperature. The proton conductivity of the SPAEK films increased with increased DS, and the highest room temperature conductivity (4.2 × 10^?2 S/cm) was recorded for a SPAEK membrane with a DS of 1.60, which further increased to 1.1 × 10^?1 S/cm at 80 °C. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 2866–2876, 2004     

Exploitation of introducing of catalytic centers into layer galleries of layered silicates and related epoxy nanocomposites. I. Epoxy nanocomposites derived from montmorillonite modified with catalytic surfactant‐bearing carboxyl groups

Montmorillonite (MMT) was modified with the acidified cocamidopropyl betaine (CAB) and the resulting organo‐montmorillonite (O‐MMT) was dispersed in an epoxy/methyl tetrahydrophthalic anhydride system to form epoxy nanocomposites. The intercalation and exfoliation behavior of the epoxy nanocomposites were examined by X‐ray diffraction and transmission electron microscopy. The curing behavior and thermal property were investigated by in situ Fourier transform infrared spectroscopy and DSC, respectively. The results showed that MMT could be highly intercalated by acidified CAB, and O‐MMT could be easily dispersed in epoxy resin to form intercalated/exfoliated epoxy nanocomposites. When the O‐MMT loading was lower than 8 phr (relative to 100 phr resin), exfoliated nanocomposites were achieved. The glass‐transition temperatures (T_g's) of the exfoliated nanocomposite were 20 °C higher than that of the neat resin. At higher O‐MMT loading, partial exfoliation was achieved, and those samples possessed moderately higher T_g's as compared with the neat resin. O‐MMT showed an obviously catalytic nature toward the curing of epoxy resin. The curing rate of the epoxy compound increased with O‐MMT loading. © 2004 Wiley Periodicals, Inc. J Polym Sci Part B: Polym Phys 42: 1192–1198, 2004